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Prof. Busnaina speaks to Internatonal Microelectronics and Packing Society

April 4, 2016

Prof Ahmed Busnaina, the Director of the NSF Center for High-rate Nanomanufacutring at Northeastern spoke last month to members of the International Microelectronics And Packaging Society.  The IMAPS New England Chapter meets monthly, and attendees include executives and leading researchers from local companies such as Lockheed, BAE, Raytheon, Analog Devices, Draper and Lincoln Labs, as well as small entrepreneurial firms.  

Busnaina’s presentation addressed nano and microscale printing of electronics and sensors, and functional materials applications. Printing is an excellent approach to making structures and devices using nano materials.  The Nanoscale Offset Printing System (NanoOPS) can print metals, insulators and semiconductors (including III-V and II-VI), organic and inorganic materials into nanoscale structures and circuits (down to 20 nanometers).   This diverse array includes nanoparticles, nanotubes, nanowires, 2D materials and polymers.  The Center for High-rate Nanomanufacturing has also developed a new way to print interconnects on any substrate as well as transistors and inverters using carbon nanotubes and 2D materials.