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Busnaina speaks at Global Conference on Semiconductor Manufacturing

October 18, 2016

Prof. Ahmed Busnaina, the Director of Northeastern’s NSF Center for High-rate Nanomanufacturing, was an invited speaker at the 2016 International Conference on Planarization/ CMP Technology, held in Beijing, China, on Oct. 17-19, 2016.  CMP (chemical mechanical planarization) is one of the most important processes in the semiconductor manufacturing, and the process has been steadily improving over the years. Busnaina’s presentation addressed the Role of CMP in the Nanoscale Printing of Electronics, Sensors, Energy and Functional Materials Applications.  Other speakers came from institutions such as Global Foundries, Toshiba, Samsung, Ebara, Huali Microelectronics, and Applied Materials.

Entities involved in the organization of this global conference included the CMP User's Group-China, IEEE Beijing Section, China Semiconductor Industry Association, Chinese Tribology Institute of the Chinese Mechanical Engineering Society, Korea CMP User Group, Northern California Chapter AVS, Europe CMP User Group, Chemical Mechanical Planarization User Group Taiwan, Planarization and CMP Technical Committee Japan, and Integrated Circuit Materials Industry Technology Innovative Alliance (ICMTIA).  The Conference Char was Xinchun Lu from Tsinghua University, and the Secretary General was Ying Shi from the ICMTIA.

Busnaina’s trip to Asia also included a stop-over in Japan to visit partners interested in research collaborations with Northeastern’s NSF Center for High-rate Nanomanufacturing.